Investigations of the impact of initial stresses on...

Microelectronics Reliability 2018 / 08 Vol. 87

Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor

Auersperg, J., Auerswald, E., Collet, C., Dean, Th., Vogel, D., Winkler, Th., Rzepka, S.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
87
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.06.019
Date:
August, 2018
File:
PDF, 2.54 MB
english, 2018
Conversion to is in progress
Conversion to is failed