Low-temperature hermetic thermo-compression bonding using...

Sensors and Actuators A: Physical 2018 / 08 Vol. 279

Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging

Al Farisi, Muhammad Salman, Hirano, Hideki, Tanaka, Shuji
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Volume:
279
Language:
english
Journal:
Sensors and Actuators A: Physical
DOI:
10.1016/j.sna.2018.06.021
Date:
August, 2018
File:
PDF, 4.02 MB
english, 2018
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