Low-temperature diffusion bonding of W/Mo joints with a...

Low-temperature diffusion bonding of W/Mo joints with a thin Cu interlayer

Rao, Mei, Zhang, Jian, Ding, Jiahui, Luo, Guoqiang, Shen, Qiang, Zhang, Lianmeng
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Volume:
262
Language:
english
Journal:
Journal of Materials Processing Technology
DOI:
10.1016/j.jmatprotec.2018.07.001
Date:
December, 2018
File:
PDF, 4.42 MB
english, 2018
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