![](/img/cover-not-exists.png)
Low-temperature diffusion bonding of W/Mo joints with a thin Cu interlayer
Rao, Mei, Zhang, Jian, Ding, Jiahui, Luo, Guoqiang, Shen, Qiang, Zhang, LianmengVolume:
262
Language:
english
Journal:
Journal of Materials Processing Technology
DOI:
10.1016/j.jmatprotec.2018.07.001
Date:
December, 2018
File:
PDF, 4.42 MB
english, 2018