Fracture analysis of electronic ic package in reflow...

Fracture analysis of electronic ic package in reflow soldering process

Ji Hyuck Yang, Kang Yong Lee, Taek Sung Lee, She-Xu Zhao
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Volume:
18
Language:
english
Pages:
13
DOI:
10.1007/bf02996101
Date:
March, 2004
File:
PDF, 1001 KB
english, 2004
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