![](/img/cover-not-exists.png)
Fracture analysis of electronic ic package in reflow soldering process
Ji Hyuck Yang, Kang Yong Lee, Taek Sung Lee, She-Xu ZhaoVolume:
18
Language:
english
Pages:
13
DOI:
10.1007/bf02996101
Date:
March, 2004
File:
PDF, 1001 KB
english, 2004