[IEEE 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Chicago, IL (2018.5.13-2018.5.17)] 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) - ESD failure analysis and robustness improvement for multi-STI-finger LDMOS used as output device
Ye, Ran, Liu, Siyang, Dai, Zhigang, Chen, Hongting, Wu, Wangran, Sun, Weifeng, Lu, Shengli, Su, Wei, Lin, Feng, Sun, GuipengYear:
2018
Language:
english
DOI:
10.1109/ISPSD.2018.8393672
File:
PDF, 1.84 MB
english, 2018