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[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effect of Solder Sphere Alloys and Surface Finishes on the Reliability of Lead-Free Solder Joints in Accelerated Thermal Cycling
Akkara, Francy John, Zhao, Cong, Athamenh, Raed, Su, Sinan, Abueed, Mohammed, Hamasha, Sa'd, Suhling, Jeff, Lall, Dr. PradeepYear:
2018
DOI:
10.1109/ITHERM.2018.8419534
File:
PDF, 1.55 MB
2018