[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Exploration of a Hybrid Analytical Thermal Topology Optimization Method for an Additively Manufactured Heat Sink
de Bock, H. PeterYear:
2018
Language:
english
DOI:
10.1109/ITHERM.2018.8419585
File:
PDF, 1.29 MB
english, 2018