[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Strength Analysis of Resin Delamination of Packaging Structure of Power Module
Teradaira, Sho, Furuyama, Yukichi, Yu, QiangYear:
2018
Language:
english
DOI:
10.1109/ITHERM.2018.8419594
File:
PDF, 877 KB
english, 2018