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Development of Copper Materials and Processing for Printed Electronics
Kuroda, Kyoko, Nakako, Hideo, Inada, Maki, Noudou, Takaaki, Kumashiro, YasushiVolume:
5
Year:
2012
Language:
english
Journal:
Transactions of The Japan Institute of Electronics Packaging
DOI:
10.5104/jiepeng.5.20
File:
PDF, 1.14 MB
english, 2012