Adhesion strength of die attach film for thin electronic...

Microelectronics Reliability 2018 / 12 Vol. 91

Adhesion strength of die attach film for thin electronic package at elevated temperature

Mose, Bruno R., Son, In-Seo, Shin, Dong-Kil
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Volume:
91
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.07.143
Date:
December, 2018
File:
PDF, 2.54 MB
english, 2018
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