[IEEE 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Oulu, Finland (2018.6.12-2018.6.14)] 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Plastic QFN Packaging for Space Applications
van Dommelen, Ignas, Bonnet, Barbara, Feron, Marc, Cherman, Vladimir, Aguinaga, Daniel, Gonzalez, MarioYear:
2018
Language:
english
DOI:
10.23919/NORDPAC.2018.8423851
File:
PDF, 461 KB
english, 2018