[IEEE 2018 Symposium on Design, Test, Integration &...

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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Roma (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Simulation of the magnetic nanoparticle filling procedure of microchambers

Palovics, Peter, Rencz, Marta
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Year:
2018
Language:
english
DOI:
10.1109/DTIP.2018.8394192
File:
PDF, 978 KB
english, 2018
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