[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics
Xu, Shanshan, Lewis, Ryan, Wen, Rongfu, Yang, Ronggui, Lee, Yung-Cheng, Kim, Woochan, Nguyen, LuuYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00338
File:
PDF, 1.23 MB
english, 2018