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[IEEE 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Oulu, Finland (2018.6.12-2018.6.14)] 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Overload-proof LTCC differential pressure sensors for high temperature applications
Goldberg, Adrian, Manhica, Birgit, Ziesche, Steffen, Partsch, UweYear:
2018
Language:
english
DOI:
10.23919/NORDPAC.2018.8423858
File:
PDF, 1.01 MB
english, 2018