Pre-annealing effect of electroless Ni−B deposit as a...

Metals and Materials International 2006 / 02 Vol. 12; Iss. 1

Pre-annealing effect of electroless Ni−B deposit as a diffusion barrier for electroplated Cu electrodes

Jae Woong Choi, Gil Ho Hwang, Won Kyu Han, Sung Goon Kang
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Volume:
12
Language:
english
Pages:
6
DOI:
10.1007/bf03027527
Date:
February, 2006
File:
PDF, 838 KB
english, 2006
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