Microstructural characterization of Al/Mg alloy interdiffusion mechanism during Accumulative Roll Bonding
Ming-Che Chen, Chih-Chun Hsieh, Weite WuVolume:
13
Language:
english
Pages:
5
DOI:
10.1007/bf03027805
Date:
June, 2007
File:
PDF, 1.03 MB
english, 2007