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[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Bonded strength and reliability under high temperature and humid environment for silver alloy bonding wire
Cao, Jun, Hua, HanYear:
2018
Language:
english
DOI:
10.23919/ICEP.2018.8374319
File:
PDF, 2.23 MB
english, 2018