[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - A highly integrated copper sintered SiC power module for fast switching operation
An, Bao Ngoc, Ishikawa, Dai, Blank, Thomas, Wurst, Helge, Demattio, Horst, Leyrer, Benjamin, Kolb, Johannes, Scherer, Torsten, Simon, Ansgar, Weber, MarcYear:
2018
Language:
english
DOI:
10.23919/ICEP.2018.8374327
File:
PDF, 1.81 MB
english, 2018