[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Introduction of Sub-2-micron Cu traces to EnCoRe enhanced copper redistribution layers for heterogeneous chip integration
Kudo, Hiroshi, Aritsuka, Yuuki, Masaya, Tanaka, Kasai, Ryohei, Suyama, Jyunichi, Takeda, Mitsuhiro, Okazaki, Yumi, Iida, Haruo, Kitayama, Daisuke, Sakamoto, Kouji, Takano, Takamasa, Akazawa, Miyuki, SYear:
2018
Language:
english
DOI:
10.23919/ICEP.2018.8374332
File:
PDF, 2.47 MB
english, 2018