[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - 3D Heterogeneous Integration with Multiple Stacking Fan-Out Package
Hsu, Feng-Cheng, Lin, Jackson, Chen, Shuo-Mao, Lin, Po-Yao, Fang, Jerry, Wang, Jin-Hua, Jeng, Shin-PuuYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00058
File:
PDF, 521 KB
english, 2018