Phosphinated polyimide hybrid films with reduced melt-flow and enhanced adhesion for flexible copper clad laminates
Tseng, I-Hsiang, Hsieh, Tsung-Ta, Lin, Ching-Hsuan, Tsai, Mei-Hui, Ma, Dai-Liang, Ko, Cheng-JungVolume:
124
Language:
english
Journal:
Progress in Organic Coatings
DOI:
10.1016/j.porgcoat.2018.04.037
Date:
November, 2018
File:
PDF, 2.27 MB
english, 2018