[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Panel Level Packaging - A View Along the Process Chain
Braun, Tanja, Becker, K.-F., Hoelck, O., Kahle, R., Wohrmann, M., Boettcher, L., Topper, M., Stobbe, L., Zedel, H., Aschenbrenner, R., Voges, S., Schneider-Ramelow, M., Lang, K.-D.Year:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00019
File:
PDF, 371 KB
english, 2018