[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process
Goubault, Baptiste, Aspar, Gabrielle, Souriau, Jean-Charles, Castagne, Laetitia, Simon, SimonGilles, Di Cioccio, Lea, Brechet, YvesYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00026
File:
PDF, 645 KB
english, 2018