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[IEEE 2017 IEEE International Integrated Reliability Workshop (IIRW) - Fallen Leaf Lake, CA (2017.10.8-2017.10.12)] 2017 IEEE International Integrated Reliability Workshop (IIRW) - Integrated solder bump electromigration test chip and coupon cards for the characterization of Pb-free SAC solders under stress
Ring, Matthew, Noble, Deborah, McGowan, Brian, Kopley, Thomas, Lloyd, James R.Year:
2017
DOI:
10.1109/IIRW.2017.8361229
File:
PDF, 446 KB
2017