Heat Dissipation Properties of Thin-Film Encapsulation by...

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Heat Dissipation Properties of Thin-Film Encapsulation by Insertion of a Metal Thin Film for Organic Light-Emitting Diodes

Zhang, Wenwen, Wu, Zhaoxin, Dong, Jun, Yan, Xuewen, Gao, Wei, Ma, Ruiqiong, Hou, Xun
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Language:
english
Journal:
physica status solidi (a)
DOI:
10.1002/pssa.201800326
Date:
August, 2018
File:
PDF, 1.58 MB
english, 2018
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