A model for etching of 3-dimensional high aspect ratio silicon structures in pulsed inductively coupled plasmas
Wang, Jun-Chieh, Tian, Wei, Rauf, Shahid, Sadighi, Samaneh, Kenney, Jason, Stout, Philip, Vidyarthi, Vinay Shankar, Guo, Janny, Zhou, Tiecheng, Lundy, Nicole, Delfin, Kenneth, Pandey, Sumeet C, Guo, SLanguage:
english
Journal:
Plasma Sources Science and Technology
DOI:
10.1088/1361-6595/aadb4b
Date:
August, 2018
File:
PDF, 2.80 MB
english, 2018