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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - A Novel Submicron Polymer Re-Distribution Layer Technology for Advanced InFO Packaging
Pu, Han-Ping, Kuo, H. J., Liu, C. S., Yu, Douglas C. H.Year:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00015
File:
PDF, 357 KB
english, 2018