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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications
Suk, Kyoung-Lim, Lee, Seok Hyun, Kim, Jong Youn, Lee, Seok Won, Kim, Hak Jin, Lee, Su Chang, Kim, Pyung Wan, Byun, Jung Soo, Kim, Dae-Woo, Oh, DanYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00018
File:
PDF, 625 KB
english, 2018