[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Micro-Silver Sinter Paste Developed for Pressure Sintering on Bare Cu Surfaces under Air or Inert Atmosphere
Chew, Ly May, Schmitt, Wolfgang, Schwarzer, Christian, Nachreiner, JensYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00056
File:
PDF, 1.00 MB
english, 2018