[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH Over 2000
Seyama, Kohei, Wada, Shoji, Eguchi, Yuji, Nakamura, Tomonori, Day, Doug, Sugawa, ShigetoshiYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00066
File:
PDF, 781 KB
english, 2018