[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Chip Stackable, Ultra-thin, High-Flexibility 3D FOWLP (3D SWIFT® Technology) for Hetero-Integrated Advanced 3D WL-SiP
Ki, WonMyoung, Lee, WonGeoL, MoK, InSu, Lee, IlBok, Do, WonChul, Kolbehdari, Moh, Copia, Alex, Jayaraman, Suresh, Zwenger, Curtis, Lee, KangWookYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00092
File:
PDF, 1.20 MB
english, 2018