[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Chip-Package Interaction Challenges for Large Die Applications
Wu, Zhuo-Jie, Carey, Charles, Donavan, Samantha, Hunt, Doug, Justison, Patrick, Anemikos, Theo, Cincotta, John, Gagnon, Hugues, Chacon, Oswaldo, Martel, Robert, Wassick, ThomasYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00104
File:
PDF, 353 KB
english, 2018