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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Warpage Control During Mass Reflow Flip Chip Assembly Using Temporary Adhesive Bonding
Goodhue, Normand-Pierre, Danovitch, David, Moussodji Moussodji, Jeff, Papineau, Benoit, Duchesne, EricYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00110
File:
PDF, 1.57 MB
english, 2018