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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level Fan Out Packages
Park, JongHo, Lee, HanMin, Lee, SeYoung, Kyung, Youjin, Kim, Jung Hak, Lee, Kwangjoo, Paik, Kyung-WookYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00111
File:
PDF, 955 KB
english, 2018