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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Study of Interface Micro-Voids Between Sputter Cu & Plating Cu: The Role of Photoresist
Ou, Y. B., Yang, T. L., Wu, W. C., Chen, B. T., Lee, K. Y., Huang, H. L., Liu, C. S., Pang, Ponder, Chen, Edward, Liu, K. C., Liao, Marvin, Ku, HarryYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00114
File:
PDF, 256 KB
english, 2018