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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Backside Optical I/O Module for Si Photonics Integrated with Electrical ICs Using Fan-Out Wafer Level Packaging Technology
Uemura, Hiroshi, Warabi, Kaori, Ohira, Kazuya, Kurita, Yoichiro, Yoshida, Haruhiko, Furuyama, Hideto, Sugizaki, Yoshiaki, Shibata, HidekiYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00127
File:
PDF, 1.86 MB
english, 2018