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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Characterization of Material Damage and Microstructural Evolution Occurring in Lead Free Solders Subjected to Cyclic Loading
Chowdhury, Md Mahmudur, Hoque, Mohd Aminul, Fu, Nianjun, Suhling, Jeffrey C., Hamasha, Sa'd, Lall, PradeepYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00134
File:
PDF, 1.41 MB
english, 2018