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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Concept for Using MID Technology for Advanced Packaging
Wurz, Ing., Wurz, Marc Christopher, Bengsch, Sebastian, Roesener, Bernd, Beringer, SebastianYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00143
File:
PDF, 892 KB
english, 2018