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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Warpage Analysis with Newly Molding Material of Fan-Out Panel Level Packaging and the Board Level Reliability Test Results
Kikuchi, Kazuhiro, Nedzu, Yuusuke, Sugino, TakashiYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00149
File:
PDF, 436 KB
english, 2018