[IEEE 2018 IEEE 68th Electronic Components and Technology...

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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Dielectric Quality of 3D Capacitor Embedded in Through-Silicon Via (TSV)

Lin, Ye, Tan, Chuan Seng
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Year:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00178
File:
PDF, 693 KB
english, 2018
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