[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - The mechanical strength of microvias in reflow cycling and environmental aging
Kiilunen, J., Frisk, L.Year:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346871
File:
PDF, 4.47 MB
english, 2017