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TEM Observation of the Al and Cu Interfaces Bonded at Room Temperature by Means of the Surface Activation Method
Suga, Tadatomo, Miyazawa, Kun&rsquo, ichi, Takagi, HidekiVolume:
54
Year:
1990
DOI:
10.2320/jinstmet1952.54.6_713
File:
PDF, 2.23 MB
1990