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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon-Interconnect Fabric
Jangam, SivaChandra, Bajwa, Adeel Ahmed, Thankkappan, Kannan K, Kittur, Premsagar, Iyer, Subramanian SrikantesYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00197
File:
PDF, 1.31 MB
english, 2018