[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages
You, Se-Ho, Jeon, Seonghwan, Oh, Dan, Kim, Kilsoo, Kim, Jaechoon, Cha, Seung-Yong, Kim, GyoungBumYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00199
File:
PDF, 732 KB
english, 2018