[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - 3-D Antenna-in-Package Design with Metallic Coating Technique
Hsu, Chih-Chun, Lin, Sheng-Mou, Chen, Ying-Chih, Wu, Wen-Zhou, Chou, Che-Ya, Chen, Charles Nan-Cheng, Gao, Gavin, Wang, Chen-ChaoYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00224
File:
PDF, 603 KB
english, 2018