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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking Applications
Jourdain, Anne, De Vos, Joeri, Rassoul, Nouredine, Zahedmanesh, Houman, Miller, Andy, Beyer, Gerald, Beyne, Eric, Walsby, Edward, Patel, Jash, Ansell, Oliver, Ashraf, Huma, Thomas, Dave, Li, Shifang,Year:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00232
File:
PDF, 1.25 MB
english, 2018