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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Realization of High Electrical Performance On-chip Thick Copper Inductor Package by Via Interface Process Improvement for Metal Contact
Yang, T. L., Yang, S. B., Huang, W. L., Chen, C. C., Kuo, C. C., Huang, G. C., Wu, K. Y., Chang, T. C., Hsu, C.C., Chang, C. L., Huang, H. L., Chen, Edward, Liu, K. C., Liao, Marvin, Kalnitsky, Alex,Year:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00255
File:
PDF, 1.03 MB
english, 2018