![](/img/cover-not-exists.png)
[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Dynamic Warpage Analysis of QFP Packages During Soldering Reflow Process and Thermal Cycle
Rovitto, Marco, Morelli, Arianna, Passagrilli, Carlo, Villa, Claudio MariaYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00283
File:
PDF, 1.09 MB
english, 2018