[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D System-in-Packaging (SiP) Using Compact Through Glass Via (TGV)-Integrated Antennas
Hwangbo, Seahee, Yoon, Yong-Kyu, Shorey, Aric B.Year:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00311
File:
PDF, 438 KB
english, 2018