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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large Packages
McCann, Scott, Lee, Ho Hyung, Refai-Ahmed, Gamal, Lee, Tom, Ramalingam, SureshYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00353
File:
PDF, 351 KB
english, 2018